Methods for configurable manufacturing and apparatus

ABSTRACT

A method of manufacturing industrial controls includes partially assembling a pre-product at a first stage in manufacturing, including at least partially populating a printed circuit board with generic components and/or laser trimmable components, storing the pre-product for later manufacturing stages. The method further includes populating the printed circuit board with unique components and/or using a laser to establish unique values of the laser trimmable components at a second stage of manufacturing to form a unique model.

TECHNICAL FIELD

The various embodiments described herein relate generally to a method ofmanufacturing, including manufacturing various models of sensors.

BACKGROUND

The manufacture of industrial controls, such as sensors, often employsthe use of a printed circuit board with electronic components mountedthereon. The populated printed circuit board is placed within a housingalong with additional components. The sensors include a wide variety oftechnical performance requirements. For instance, proximity sensors comein a variety of different sizes, lengths, mounting configurations,sensing ranges, and output configurations. In an example, a 12 mmcylindrical proximity sensor may have two different housing lengths,shielded and unshielded mounting configurations, a standard and extendedsensing distance, and a variety of output configurations. The widevariety of technical performance requirements may require the printedcircuit board to have a variety of shapes, and for a variety ofelectronic components to be mounted on the printed circuit board. Eachproximity sensor model has a unique set of performance requirements andhas a unique printed circuit board, with a unique set of electroniccomponents mounted thereon. This results in the need for a large numberof unique printed circuit boards to be created and stocked as part ofthe manufacturing process.

SUMMARY

A method of manufacturing a series of products within a product line isdescribed herein. The method includes partially assembling a printedcircuit board at a first stage in manufacturing, including partiallypopulating the printed circuit board with generic components, where theprinted circuit board is usable in all of the products within theproduct line, where the generic components are common to two or moreproducts. The method further includes populating the printed circuitboard with unique components at a second stage in manufacturing andcreating an end product, where populating the printed circuit board withthe unique components establishes performance features of the endproduct, and disposing the populated printed circuit board within ahousing.

In another option, the method includes assembling a printed circuitboard at a first stage in manufacturing, including populating theprinted circuit board with generic components, where the printed circuitboard is usable in all of the products within the product line, wherethe generic components are common to two or more products. The methodfurther includes populating the printed circuit board with one or morelaser trimmable components at a first stage in manufacturing. The methodfurther includes using a laser at a second stage in manufacturing andcreating an end product, where using the laser to trim the lasertrimmable components establishes their final unique values and therebyestablishes performance features of the end product, and disposing thepopulated printed circuit board within a housing.

In another option, the method further includes coupling the printedcircuit board with an interface board. In a further option, populatingthe printed circuit board with unique components includes populating theprinted circuit board with at least one of an oscillating frequencysetting component and/or a temperature compensation component. In afurther option, populating the printed circuit board with lasertrimmable components includes populating the printed circuit board withat least one of an oscillating frequency setting component and/or atemperature compensation component.

An industrial control, such as a proximity sensor, is further discussedherein. The proximity sensor comprises a housing, a printed circuitboard having components mounted thereon, the components including one ormore generic components and one or more unique components, and theprinted circuit board disposed within the housing. The sensor furtherincludes at least one coil assembly coupled with the printed circuitboard, and the at least one coil assembly is disposed within thecylindrical housing. At least one interface board is coupled between theat least one coil assembly and the printed circuit board, and the atleast one interface board has a width that is greater than the printedcircuit board.

In another option, the proximity sensor comprises a housing, a printedcircuit board having components mounted thereon, the componentsincluding one or more generic components and one or more laser trimmablecomponents, and the printed circuit board disposed within the housing.The sensor further includes at least one coil assembly coupled with theprinted circuit board, and the at least one coil assembly is disposedwithin the cylindrical housing. At least one interface board is coupledbetween the at least one coil assembly and the printed circuit board,and the at least one interface board has a width that is greater thanthe printed circuit board.

Several options for the proximity sensor are as follows. For instance,the unique components include one or more oscillating frequency settingcomponents such as, but not limited to, a capacitor. In another option,the unique components include a temperature compensation network thatconsists of, but is not limited to, one or more resistors and/orthermistors. In another option, the laser trimmable components includeone or more oscillating frequency setting components such as, but notlimited to, a laser trimmable capacitor. In another option, the lasertrimmable components include a temperature compensation network thatconsists of, but is not limited to, one or more laser trimmableresistors.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates a perspective view of an industrial control such asan inductive proximity sensor according at least one embodiment.

FIG. 2 illustrates a cross-sectional view of an inductive proximitysensor according to at least one embodiment.

FIG. 3 illustrates a portion of an inductive proximity sensor accordingto at least one embodiment.

FIG. 4 illustrates a cross-sectional view of an inductive proximitysensor according to at least one embodiment.

FIG. 5 illustrates a portion of an inductive proximity sensor accordingto at least one embodiment.

FIG. 6 illustrates an exploded cross-sectional side view of an inductiveproximity sensor according to at least one embodiment.

DETAILED DESCRIPTION

The following detailed description refers to the accompanying drawingsthat show, by way of illustration, specific details and embodiments inwhich the invention may be practiced. These embodiments, which are alsoreferred to herein as “examples,” or “options” are described insufficient detail to enable those skilled in the art to practice theinvention.

A method of manufacturing a series or products within a produc line isdescribed herein. FIG. 1 illustrates an example of an industrialcontrol, such as a proximity sensor 100 for sensing one or more objects113, that can be manufactured using one or more of the methods. Theproximity sensor has an elongate cylindrical housing 102. The housing102 can have a variety of shapes. For instance, the housing 102 can havea rectangular prism shape, cube shape, or other shapes. The housing 102is defined in part by a longitudinal axis 106. The proximity sensor 100includes internal electronics, such as sensing circuitry, such as thatfor an inductive type of proximity sensor.

Referring to FIGS. 2 and 3, a printed circuit board 108 includescomponents mounted thereon, and the printed circuit board 108 isdisposed within the housing 102. The components include genericcomponents 110 and one or more unique components 112. The genericcomponents 110 are common to several different models and versions ofthe proximity sensor 100, and in an option, the generic components 110are common for all possible model configurations. The unique components112 are unique to the various models of the sensors. The genericcomponents 110 are populated onto the printed circuit board 108 to forma pre-product at a first stage in manufacturing. The printed circuitboard 108 having the generic components 110 is usable in all of theproducts within the product line. The pre-product can be stored, such asstocked, and used for several or all models of the sensor, to bedetermined at a later stage in manufacturing. The printed circuit board108 is partially assembled at this first stage of manufacturing.

The unique components 112 are populated at a second stage inmanufacturing to create an end product. The population of the uniquecomponents 112 establishes performance features of the end product, tocreate a unique model. In an option, the unique components 112 includeone or more oscillating frequency setting components such as, but notlimited to, a capacitor. In another option, the unique components 112include one or more temperature compensation components, such asresistors and/or thermistors, that form the temperature compensationnetwork. The assembly is coupled with other components, if necessary,and disposed within a housing.

The sensor 100 further includes an interface board 114 and at least onecoil assembly 116. The at least one interface board 114 is coupledbetween the at least one coil assembly 116 and the printed circuit board108, for example after the second stage in manufacturing. The at leastone interface board 114, the at least one coil assembly 116, and theprinted circuit board 108 are disposed within the housing 102. In anoption, the at least one coil assembly 116 has a diameter that isgreater than the width of the printed circuit board 108. The printedcircuit board 108, with the generic components 110 and unique components112, is connected with the interface board 114, for example by solderingthe printed circuit board 108 with the interface board 114. Theinterface board 114 is coupled with the at least one coil assembly 116,for example, by use of bobbin pins 117. The shape of the interface board114 is optionally rectangular, and is disposed transverse to the planeof the printed circuit board 108.

Referring to FIGS. 4 and 5, a printed circuit board 108 includescomponents mounted thereon, and the printed circuit board 108 isdisposed within the housing 102. The components include genericcomponents 110 and one or more laser trimmable components 115. Thegeneric components 110 are common to several different models andversions of the proximity sensor 100, and in an option, the genericcomponents 110 and laser trimmable components 115 are common for allpossible model configurations. The generic components 110 and lasertrimmable components 115 are populated onto the printed circuit board108 to form a pre-product at a first stage in manufacturing, wherein theprinted circuit board 108 having the generic components 110 and lasertrimmable components 115 is usable in all of the products within theproduct line. The pre-product can be stored, such as stocked, and usedfor several or all models of the sensor, to be determined at a laterstage in manufacturing. The printed circuit board 108 is partiallyassembled at this first stage of manufacturing.

The use of a laser at a second stage of manufacturing to trim the lasertrimmable components 115 can be used to establish their final values,which may be unique to each model, and thereby establishes performancefeatures of the end product, to create a unique model. In an option, thelaser trimmable components 115 include one or more oscillating frequencysetting components such as, but not limited to, a laser trimmablecapacitor. In another option, the laser trimmable components 115 includeone or more temperature compensation network components such as, but notlimited to, a laser trimmable resistor. The assembly is coupled withother components, if necessary, and disposed within a housing.

The sensor 100 further includes an interface board 114 and at least onecoil assembly 116. The at least one interface board 114 is coupledbetween the at least one coil assembly 116 and the printed circuit board108, for example after a second stage in manufacturing. The at least oneinterface board 114, the at least one coil assembly 116, and the printedcircuit board 108 are disposed within the housing 102. In an option, theat least one coil assembly 116 has a diameter that is greater than thewidth of the printed circuit board 108. The printed circuit board 108,with the generic components 110 and laser trimmable components 115, isconnected with the interface board 114, for example by soldering theprinted circuit board 108 with the interface board 114. The interfaceboard 114 is coupled with the at least one coil assembly 116, forexample, by use of bobbin pins 117. The shape of the interface board 114is optionally rectangular, and is disposed transverse to the plane ofthe printed circuit board 108.

FIG. 6 illustrates an example apparatus using at least one of themethods herein. The printed circuit board 108 is sized to be received inmultiple housings. The housings are formed from components 102 a or 102b and 103 a or 103 b. The components 102 a, 102 b, 103 a, 103 b areinterchangeable, where 103 a can be used with either 102 a or 102 b toform various housings. In addition, 103 b can be used with either 102 aor 102 b to form various housings. The printed circuit board 108 ispopulated, in an option, with generic components, which are common toall possible models at a first stage of manufacturing. At a second stageof manufacturing, the unique components are selected and populated ontothe printed circuit board 108, which determines performance features ofthe sensor such as the oscillating frequency and/or temperaturecompensation. In a further option, the printed circuit board 108 ispopulated with generic components and laser trimmable components, whichare common to all possible models, at a first stage of manufacturing. Ata second stage of manufacturing, a laser is used to establish the valueof at least one of the laser trimmable components on the printed circuitboard 108. For example, a trimmable resistor is laser trimmed to set itsresistance value. The interface board 114 a, 114 b, 114 c, in an option,is selected based on the diameter of the coil assembly 116 and assembledafter the second stage of manufacturing.

The methods herein can be used to stock fewer populated printed circuitboards to form several different components at the second or final stageof manufacturing, instead of stocking several different populatedprinted circuit boards for final assembly. While these methods have beendiscussed relative to proximity sensors, it is possible these methodscan be used to form other sensors such as, but not limited to,photoelectric sensors.

The above Detailed Description is intended to be illustrative, and notrestrictive. The various embodiments are not necessarily mutuallyexclusive, as some embodiments can be combined with one or more otherembodiments to form new embodiments. For example, the above-describedembodiments (and/or aspects thereof) embodiments may be combined,utilized and derived therefrom, such that structural and logicalsubstitutions and changes may be made without departing from the scopeof this disclosure. Such embodiments of the inventive subject matter maybe referred to herein, individually and/or collectively, by the term“invention” merely for convenience and without intending to voluntarilylimit the scope of this application to any single invention or inventiveconcept if more than one is in fact disclosed. Many other embodimentswill be apparent to those of skill in the art upon reviewing the abovedescription. The scope of the invention should, therefore, be determinedwith reference to the appended claims, along with the full scope ofequivalents to which such claims are entitled.

The methods described herein do not have to be executed in the orderdescribed, or in any particular order, unless it is otherwise specifiedthat a particular order is required. Moreover, unless otherwisespecified, various activities described with respect to the methodsidentified herein can be executed in repetitive, simultaneous, serial,or parallel fashion.

The terms “a” or “an” are used, as is common in patent documents, toinclude one or more than one. The term “or” is used to refer to anonexclusive or, unless otherwise indicated. In the appended claims, theterms “including” and “in which” are used as the plain-Englishequivalents of the respective terms “comprising” and “wherein.” Also, inthe following claims, the terms “including” and “comprising” areopen-ended, that is, a system, device, article, or process that includeselements in addition to those listed after such a term in a claim arestill deemed to fall within the scope of that claim. Moreover, in thefollowing claims, the terms “first,” “second,” and “third,” etc. areused merely as labels, and are not intended to impose numericalrequirements on their objects.

The Abstract of the Disclosure is provided to comply with 37 C.F.R.§1.72(b), requiring the abstract that will allow the reader to quicklyascertain the nature of the technical disclosure. It is submitted withthe understanding that it will not be used to interpret or limit thescope or meaning of the claims. In addition, in the foregoing DetailedDescription, it can be seen that various features are grouped togetherin a single embodiment for the purpose of streamlining the disclosure.This method of disclosure is not to be interpreted as reflecting anintention that the claimed embodiments require more features than areexpressly recited in each claim. Rather, as the following claimsreflect, inventive subject matter lies in less than all features of asingle disclosed embodiment. Thus the following claims are herebyincorporated into the Detailed Description, with each claim standing onits own as a separate embodiment with each embodiment being combinablewith each other embodiment.

1. A method of manufacturing a series of products within a product line,the method comprising: partially assembling a printed circuit board at afirst stage in manufacturing, including partially populating the printedcircuit board with generic components, where the printed circuit boardis usable in all of products within the product line, where the genericcomponents are common to two or more products; populating the printedcircuit board with unique components at a second stage in manufacturingand creating an end product, where populating the printed circuit boardwith the unique components establishes performance features of the endproduct; and disposing the populated printed circuit board within ahousing.
 2. The method as recited in claim 1, further comprisingcoupling the printed circuit board with an interface board after asecond stage in manufacturing.
 3. The method as recited in claim 1,wherein populating the printed circuit board with unique componentsincludes populating the printed circuit board with at least oneoscillating frequency setting component.
 4. The method as recited inclaim 1, wherein populating the printed circuit board with uniquecomponents includes populating the printed circuit board with at leastone temperature compensation component.
 5. The method as recited inclaim 1, further comprising forming a proximity sensor.
 6. The method asrecited in claim 1, further comprising forming a photoelectric sensor.7. A method of manufacturing a series of products within a product line,the method comprising: partially assembling a printed circuit board at afirst stage in manufacturing, including populating the printed circuitboard with generic components and laser trimmable components, where theprinted circuit board is usable in all of products within the productline, where the generic components are common to two or more products;laser trimming at least one of the laser trimmable components at asecond stage in manufacturing and creating an end product, where lasertrimming the trimmable components on the printed circuit boardestablishes performance features of the end product; and disposing thepopulated printed circuit board within a housing.
 8. The method asrecited in claim 7, further comprising coupling the printed circuitboard with an interface board after a second stage in manufacturing. 9.The method as recited in claim 7, wherein laser trimming the at leastone laser trimmable component changes a value of the at least onecomponent.
 10. The method as recited in claim 7, wherein populating theprinted circuit board with laser trimmable components includespopulating the printed circuit board with at least one oscillatingfrequency setting component.
 11. The method as recited in claim 7,wherein populating the printed circuit board with laser trimmablecomponents includes populating the printed circuit board with at leastone temperature compensation component.
 12. The method as recited inclaim 7, further comprising forming a proximity sensor.
 13. The methodas recited in claim 7, further comprising forming a photoelectricsensor.
 14. A proximity sensor comprising: a housing; a printed circuitboard having components mounted thereon, the components include one ormore generic components and one or more unique components, the printedcircuit board disposed within the housing; at least one coil assemblycoupled with the printed circuit board, the at least one coil assemblydisposed within the cylindrical housing; and at least one interfaceboard coupled between the at least one coil assembly and the printedcircuit board, and the at least one interface board has a width that isgreater than the printed circuit board.
 15. The proximity sensor asrecited in claim 14, wherein the unique components include one or moreoscillating frequency setting components.
 16. The proximity sensor asrecited in claim 15, wherein the one or more oscillating frequencysetting components is a capacitor.
 17. The proximity sensor as recitedin claim 14, wherein the unique components include one or moretemperature compensation network components.
 18. The proximity sensor asrecited in claim 17, wherein the one or more temperature compensationnetwork components includes one or more of a resistor or thermistor. 19.The proximity sensor as recited in claim 14, wherein the interface boardhas a generally rectangular shape.
 20. The proximity sensor as recitedin claim 14, wherein the printed circuit board is manufactured to allowthe printed circuit board to be used with two or more different housinglengths.